View TF024_845647.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

DISCRETE CERAMICS
DATA SHEET
TFx24 series, 0.05% TC50 10 to 1 M
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 and 0402
www.phycomp-components.com
Product specification
2001 Sep 10 Rev.0
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 and 0402
FEATURES * High precision * High long-term stability * Low temperature coefficient. APPLICATIONS * Converters * Printer equipment * Motherboards * Telecom * Consumer. DESCRIPTION
TFx24 series, 0.05% TC50 10 to 1 M
The resistive layer is covered with a protective coating and printed with the resistance value. Finally, the two external end terminations are added. To guarantee optimum solderability the outer layer consists of a lead-tin alloy.
The resistors are constructed on a high grade ceramic body (aluminium oxide). Internal metal electrodes are added at each end and connected by a resistive paste which is applied to the top surface of the substrate. The composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to within tolerance, by laser cutting of this resistive layer.
QUICK REFERENCE DATA VALUE DESCRIPTION TF524 Size code Resistance range Resistance tolerance and series Temperature coefficient Maximum dissipation at Tamb = 70 C Maximum permissible voltage (DC or RMS) Climatic category (IEC 60068) Basic specification 0.25 W 200 V 0.125 W 200 V 1210 10 to 1 M TF024 1206 10 to 1 M TF124 0805 10 to 1 M 50 x 10-6/K 0.125 W 150 V 55/125/56 IEC 60115-8 and MIL-STD-202F 0.1 W 75 V 0.0625 W 50 V 0.05%; E24 and E96 series TF224 0603 TF324 0402
10 to 332 k 10 to 100 k
2001 Sep 10 Rev.0
2
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 and 0402
ORDERING INFORMATION Table 1 TYPE TF524 TF024 TF124 TF224 TF324 Ordering code indicating resistor type and packing SIZE CODE 1210 1206 0805 0603 0402 RESISTANCE VALUE 10 to 1 M 10 to 1 M 10 to 1 M 10 to 332 k 10 to 100 k Table 2 TOL. (%) 0.05 0.05 0.05 0.05 0.05 Last digit of 12NC LAST DIGIT 9 1 2 3 4 5
TFx24 series, 0.05% TC50 10 to 1 M
PAPER TAPE ON REEL 5000 5000 5000 5000 10000
12NC ORDERING CODE 2390 412 3xxxx 2390 411 3xxxx 2390 401 3xxxx 2390 404 3xxxx 2390 407 3xxxx
Ordering code (12NC) * The resistors have a 12-digit ordering code starting with 2390; see Table 1. * The subsequent 4 digits indicate the resistor type and packing. * The remaining 4 digits indicate the resistance value: - The first 3 digits indicate the resistance value. - The last digit indicates the resistance decade in accordance with Table 2.
ORDERING EXAMPLE The ordering code of a TF024 resistor, value 1000 with 0.05% tolerance, supplied on paper tape of 5 000 units per reel is: 2390 411 31002.
RESISTANCE DECADE 10 to 97.6 100 to 976 1 k to 9.76 k 10 k to 97.6 k 100 k to 976 k 1 M
2001 Sep 10 Rev.0
3
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 and 0402
FUNCTIONAL DESCRIPTION Product characterization Standard values of nominal resistance are taken from the E24 and E96 series for resistors with a tolerance of 0.05%. The values of the E24 and E96 series are in accordance with "IEC publication 60063". Limiting values LIMITING VOLTAGE (note 1) (V) 200 200 150 75 50 LIMITING POWER (W) 0.25 0.125 0.125 0.1 0.0625 Fig.1
50
TFx24 series, 0.05% TC50 10 to 1 M
DERATING The power that the resistor can dissipate depends on the operating temperature; see Fig.1.
handbook, halfpage P
max (%Prated ) 100
MLB206
TYPE
TF524 TF024 TF124 TF224 TF324 Note
0 55 0 50 70 100 125 o Tamb ( C)
Maximum dissipation (Pmax) in percentage of rated power as a function of the ambient temperature (Tamb).
1. The maximum voltage that may be continuously applied to the resistor element, see "IEC publication 60115-8".
2001 Sep 10 Rev.0
4
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 and 0402
MECHANICAL DATA Mass per 100 units TYPE TF524 TF024 TF124 TF224 TF324 MASS (g) 1.67 1 0.55 0.25 0.052
T
TFx24 series, 0.05% TC50 10 to 1 M
OUTLINES
protective coat resistor layer inner electrode end termination
ceramic substrate tb protective coat tt marking
Marking TYPE TF524 TF024 TF124 TF224 TF324 4-DIGIT MARKING For values up to 976 the R is used as a decimal point. For values of 1 k or greater the first 3 digits apply to the resistance value and the fourth indicates the number of zeros to follow. Example MARKING 10R0 10R2 1001 RESISTANCE 10 10.2 1 k E24 4 digits 4 digits 4 digits 3 digits E96 4 digits 4 digits 4 digits 3 digits EIA-96
W
1001
CCB633
L
For dimensions see Table 3.
no marking Table 3 TYPE TF524 (1210) TF024 (1206) TF124 (0805) TF224 (0603) TF324 (0402)
Fig.2 Outlines. Chip resistor type and relevant physical dimensions; see Fig.2 L (mm) 3.1 0.1 3.1 0.1 2.0 0.1 1.6 0.1 1.0 0.1 W (mm) 2.6 0.1 1.6 0.1 1.25 0.1 0.8 0.1 0.50 0.05 T (mm) 0.55 0.1 0.55 0.1 0.50 0.1 0.45 0.1 0.25 0.05 tt (mm) 0.50 0.2 0.45 0.2 0.35 0.2 0.25 0.15 0.20 0.1 tb (mm) 0.5 0.2 0.4 0.2 0.35 0.2 0.25 0.15 0.25 0.1
2001 Sep 10 Rev.0
5
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 and 0402
3-DIGIT MARKING The first 2 digits apply to the resistance value and the third indicates the number of zeros to follow. Example MARKING 120 123 124 RESISTANCE 12 12 k 120 k 3-DIGIT EIA-96 MARKING
TFx24 series, 0.05% TC50 10 to 1 M
MARKING OF PACKING MATERIAL The packing material is also marked and includes resistance value, tolerance, catalogue number, quantity, production period, batch number and source code.
The first 2 digits apply to the resistance value and the third character indicates the multiplier as shown in Tables 4 and 5. Example MARKING 10X 10C 10D RESISTANCE 12.4 12.4 k 124 k
Table 4
First two digits of the resistance code VALUE 100 102 105 107 110 113 115 118 121 124 127 130 133 137 140 143 147 150 154 158 162 165 169 174 Multiplier codes Y 10-2 X 10-1 A 1 B 10 6 C 102 D 103 E 104 F 105 CODE 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 VALUE 178 182 187 191 196 200 205 210 215 221 226 232 237 243 249 255 261 267 274 280 287 294 301 309 CODE 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 63 65 66 67 68 69 70 71 72 VALUE 316 324 332 340 348 357 365 374 383 392 402 412 422 432 442 453 464 475 487 499 511 523 536 549 CODE 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 VALUE 562 576 590 604 619 634 649 665 681 698 715 732 750 768 787 806 825 845 866 887 909 931 953 976
CODE 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Table 5 CODE Multiplier
2001 Sep 10 Rev.0
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 and 0402
TESTS AND REQUIREMENTS Essentially all tests are carried out in accordance with the schedule of "IEC publication 60115-8", category 55/125/56 (rated temperature range -55 to +125 C; damp heat, long term, 56 days). The testing also covers the requirements specified by EIA and MIL-STD-202F. The tests are carried out in accordance with IEC publication 60068, "Recommended basic climatic and mechanical robustness testing procedure for electronic components" and under standard atmospheric conditions in accordance with "IEC 60068-1", subclause 5.3.
TFx24 series, 0.05% TC50 10 to 1 M
Temperature: 15 C to 35 C Relative humidity: 25% to 75% Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
Unless otherwise specified the following values apply:
In Table 6 the tests and requirements are listed with reference to the relevant clauses of "IEC publications 60115-8, 60068 and MIL-STD" ; a short description of the test procedure is also given. In some instances deviations from the IEC recommendations were necessary for our method of specifying. All soldering tests are performed with mildly activated flux.
Table 6
Test procedures and requirements IEC 60068-2 TEST METHOD
IEC 60115-8 CLAUSE 4.4.1 4.4.2 4.5
MIL-STD
TEST
PROCEDURE
REQUIREMENTS
visual examination dimensions (outline) resistance gauge applied voltage (+0/-10%): 10 R < 100 : 0.3 V 100 R < 1 k: 1 V 1 k R < 10 k: 3 V 10 k R < 100 k: 10 V 100 k R < 1 M: 25 V 1 M: 50 V unmounted chips; 10 1 s; 260 5 C
no holes; clean surface; no damage see Table 3 R - Rnom: max. 0.05%
4.18
20 (Tb)
202F method 210C 202F method 208G 202F method 301
resistance to soldering heat
no visible damage R/R max.: (0.5% +0.05 ) good tinning (95% covered); no damage no breakdown or flashover
4.17
20 (Ta)
solderability unmounted chips completely immersed for 5 0.5 s in a solder bath at 230 5 C voltage proof on insulation maximum voltage (RMS) during 1 minute, metal block method room temperature; V = 2.5 x Vrated; 5 s (voltage not more than 2 x Vmax); specimen stabilized at room temperature for 30 minutes
4.7
4.13
MIL-R short time 55342D overload para. 4.7.5
R/R max.: (0.5% +0.05 )
2001 Sep 10 Rev.0
7
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 and 0402
IEC 60115-8 CLAUSE 4.33 IEC 60068-2 TEST METHOD
TFx24 series, 0.05% TC50 10 to 1 M
MIL-STD
TEST
PROCEDURE
REQUIREMENTS
bending
resistors mounted on a 90 mm glass epoxy resin PCB (FR4); bending: 2 mm for 1210 2 mm for 1206 3 mm for 0805 3 mm for 0603 2 mm for 0402
no visual damage R/R max.: (0.25% +0.05 )
-65 +0/-5 C for 1 hour; MIL-R low 55342D temperature loaded with Vrated for para. 4.7.4 operation 45 +5/-0 minutes ON, and 15 +5/-0 minutes OFF; specimen stabilized at room temperature for 24 hours after test 4.19 14 (Na) 202F method 107 202F method 108A thermal shock endurance 2 minutes at LCT and 2 minutes at UCT; 5 cycles 1000 +48/-0 hours; 70 2 C; loaded with Pn or Vmax; 1.5 hours on and 0.5 hours off; specimen stabilized at room temperature for 1 hour min. after test
no visible damage R/R max.: (0.5% +0.05 )
no visible damage R/R max.: (0.5% +0.05 ) R/R max.: (0.5% +0.05 )
4.25.1
4.8.4.2
202F method 304 202F method 302
temperature at 25/LCT/25 C and coefficient 25/UCT/25 C insulation resistance after 1 minute, metal block method 1210: 400 V (DC) 1206: 400 V (DC) 0805: 300 V (DC) 0603: 150 V (DC) 0402: 100 V (DC) unmounted chips; 60 1 s; 260 5 C 65 2 C; 95 +3/-5% RH; loaded with 0.01 Pn or Vmax for 42 damp heat cycles. (1 cycle consists of 7 steps. see Fig.3)
50 x 10-6/K
4.6.1.1
Rins min.: 104 M
EIA 575 3.13 EIA/IS 703 4.6 202F method 106
leaching moisture resistance
good tinning; no leaching R/R max.: (0.5% +0.05 )
2001 Sep 10 Rev.0
8
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 and 0402
TFx24 series, 0.05% TC50 10 to 1 M
75 temperature [C] 50 initial drying 24 hours
90 - 98% RH
80 - 98% RH
90 - 98% RH
80 - 98% RH
90 - 98% RH
rate of change of temperature is unspecified, however, specimens shall not be subjected to radiant heating from chamber conditioning processes +10 C (+18 F) -2 C (-3.6 F) initial measurements as specified in 2.2 circulation of conditioning air shall be at a minimum cubic rate per minute equivalent to 10 times the volume of the chamber
end of final cycle; measurements as specified in 2.7
25
0
temperature tolerance 2 C (3.6 F) unless otherwise specified STEP1 prior to first cycle only
HBK073
optional sub-cycle if specified (2.3); sub-cycle performed during any 5 of the first 9 cycles; humidity uncontrolled during sub-cycle
voltage applied as specified in 2.4
STEP2
STEP3
STEP4
STEP5
STEP6
STEP7
one cycle 24 hours; repeat as specified in 2.5 0 5 10 15 20 time [h] 25
Fig.3 Moisture resistance test requirements.
2001 Sep 10 Rev.0
9
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 and 0402
MOUNTING Due to their rectangular shape and small dimensional tolerances, surface-mounted resistors are suitable for handling by automatic placement systems. Chip placement can be on ceramic substrates and Footprint dimensions
TFx24 series, 0.05% TC50 10 to 1 M
printed-circuit boards (PCBs). Electrical connection to the circuit is by soldering. The finishing of the end terminations guarantees a reliable contact.
handbook, full pagewidth
solder land / solder paste pattern
preferred direction during wave soldering
D
G
solder resist pattern
occupied area
E C B A F
tracks
MBG628
E: available area for tracks underneath the chip
For dimensions see Table 7.
Fig.4 Recommended footprint dimensions.
Table 7 TYPE TFx324 TFx224 TFx124 TFx024 TFx524 Table 8 TYPE TFx224 TFx124 TFx024 TFx524
Reflow soldering; for dimensions see also Fig.4 SIZE CODE 0402 0603 0805 1206 1210 FOOTPRINT DIMENSIONS (mm) PROCESSING REMARKS A 1.5 2.1 2.6 3.8 3.8 B 0.5 0.5 0.9 2.0 2.0 C 0.5 0.8 0.85 0.9 0.9 D 0.6 0.9 1.4 1.8 2.7 E 0.1 0.0 0.5 1.4 1.4 F 1.9 2.5 3.0 4.2 4.2 G 1.0 1.7 2.1 2.5 3.4 IR soldering PLACEMENT ACCURACY (mm) 0.15 0.25 0.25 0.25 0.25
Wave soldering; for dimensions see also Fig.4 SIZE CODE 0603 0805 1206 1210 FOOTPRINT DIMENSIONS (mm) A 2.7 3.3 4.5 5.3 B 0.9 1.3 2.5 2.3 C 0.9 1.0 1.0 1.5 D 0.8 1.3 1.7 2.6 E 0.15 0.34 1.25 1.25 F 3.2 3.9 3.9 6.3 10 G 1.9 2.4 2.4 4.2 PROPOSED NUMBER AND DIMENSIONS OF DUMMY TRACKS (mm) 1 x (0.15 x 0.8) 1 x (0.3 x 1.3) 3 x (0.25 x 1.7) 3 x (0.25 x 2.6) PLACEMENT ACCURACY (mm) 0.25 0.25 0.25 0.25
2001 Sep 10 Rev.0
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 and 0402
SOLDERING CONDITIONS The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260 C for one minute. Therefore, it is possible to mount surface-mount resistors on one side of a PCB and other components on the reverse side (mixed PCBs).
TFx24 series, 0.05% TC50 10 to 1 M
Surface-mount resistors are tested for solderability at 235 C during 2 seconds. The test condition for no leaching is 260 C for 60 seconds. Typical examples of soldering processes that provide reliable joints without any damage, are given in Figs 5 and 6.
300
10 s 260 C
MLA859
T
(C) 250 245 C 215 C 200 180 C 40 s 10 s
150
130 C
100 2 K/s 50
0 0 50 100 150 200 t (s) 250
Typical values (solid line). Process limits (dotted lines).
Fig.5 Infrared soldering.
2001 Sep 10 Rev.0
11
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 and 0402
TFx24 series, 0.05% TC50 10 to 1 M
300
10 s
MLA861
T
(C) 250 235 C to 260 C second wave
200
first wave
5 K/s 2 K/s
150
200 K/s
100 C to 130 C 100
forced cooling
50
2 K/s
0 0 50 100 150 200 t (s) 250
Typical values (solid line). Process limits (dotted lines). The resistors may be soldered twice in accordance with this method if desired.
Fig.6 Double wave soldering.
2001 Sep 10 Rev.0
12
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 and 0402
PACKING Tape and reel specifications All tape and reel specifications are in accordance with "IEC 60286-3". Basic dimensions are given in Figs 7, 8 and 9 and Tables 9, and 10. Peel-off force
TFx24 series, 0.05% TC50 10 to 1 M
Peel-off forces of both paper and blister tapes are in accordance with "IEC 60286-3" ; that is, at a peel-off speed of 300 10 mm/minute, 0.1 N to 1.0 N for 8 mm tape. The peel-off angle should be between 165 and 180.
Paper tape specification
P0
handbook, full pagewidth
T
D0
P2 E
cover tape B0
F
W
MBG251
Cumulative tolerance over 10 holes: 0.2 mm. Bottom fixing tape thickness: 50 10 m. Top fixing tape thickness: 50 10 m. For dimensions see Table 9.
A0
P1
Fig.7 Paper tape. Table 9 Dimensions of paper tape for relevant chip size; see Fig.7 TYPE AND SIZE CODE SYMBOL TF324 (0402) SIZE A0 B0 W E F D0 P0 P1 P2 T 0.65 1.15 8.0 1.75 3.50 1.5 4.0 2.0 2.0 0.53 TOL. 0.1 0.1 0.2 0.1 0.05 +0.1/-0 0.1 0.05 0.05 0.1 TF224 (0603) SIZE 1.10 1.90 8.0 1.75 3.50 1.5 4.0 4.0 2.0 0.7 TOL. 0.1 0.1 0.2 0.1 0.05 +0.1/-0 0.1 0.05 0.05 0.1 TF124 (0805) SIZE 1.65 2.40 8.0 1.75 3.50 1.50 4.0 4.0 2.0 0.85 TOL. 0.1 0.1 0.2 0.1 0.05 +0.1/-0 0.1 0.05 0.05 0.1 TF024 (1206) SIZE 1.90 3.50 8.0 1.75 3.50 1.5 4.0 4.0 2.0 0.85 TOL. 0.1 0.1 0.2 0.1 0.05 +0.1/-0 0.1 0.05 0.05 0.1 TF524 (1210) SIZE 2.80 3.50 8.0 1.75 3.50 1.5 4.0 4.0 2.0 0.85 TOL. 0.1 0.1 0.2 0.1 0.05 +0.1/-0 0.1 0.05 0.05 0.1 mm mm mm mm mm mm mm mm mm mm UNIT
2001 Sep 10 Rev.0
13
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 and 0402
Tape leader/trailer specification
TFx24 series, 0.05% TC50 10 to 1 M
leader end trailer end
empty compartments with cover tape (min. 240 mm) cover tape only
trailer (max. 260 mm)
leader 400 mm
CCB325
Fig.8 Leader/trailer tape.
Taping requirements Resistance side facing up. Component is free and not sticking to top and/or bottom tape. Component should be easy to remove from the carrier tape and the chip cavity should have no mechanical damage.
2001 Sep 10 Rev.0
14
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 and 0402
Reel specification
TFx24 series, 0.05% TC50 10 to 1 M
W2
C
N
A
HBK039
W1
Dimensions in mm. For reel dimensions see Table 10.
Fig.9 Reel. Table 10 Reel dimensions; see Fig.9 TYPE TF324 TF224 TF124 TF024 TF524 SIZE CODE 0402 0603 0508 1206 1210 UNITS PER REEL 10000 5000 5000 5000 5000 8 180 +0/-3 60 +1/-0 13.0 0.2 9.0 0.3 11.4 1 TAPE WIDTH (mm) A (mm) N (mm) C (mm) W1 (mm) W2 MAX. (mm)
2001 Sep 10 Rev.0
15
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 and 0402
REVISION HISTORY Revision Rev.0 Date 2001 Sep 10 Change Notification EBR-324001177 Description
TFx24 series, 0.05% TC50 10 to 1 M
- First issue of this specification - Expansion of the thin-film low-TC product range
2001 Sep 10 Rev.0
16
www.phycomp-components.com

▲Up To Search▲

Price & Availability of TF024

	To Download TF024 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .